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1

[ACM Press the 2nd international conference - Baltimore, MD, USA (2004.11.03-2004.11.05)] Proceedings of the 2nd international conference on Embedded networked sensor systems - SenSys '04 - An analysis of a large scale habitat monitoring application

Szewczyk, Robert, Mainwaring, Alan, Polastre, Joseph, Anderson, John, Culler, David

Year:

2004

Language:

english

File:

PDF, 1.17 MB

english, 2004

2

[ACM Press the 1st ACM international workshop - Atlanta, Georgia, USA (2002.09.28-2002.09.28)] Proceedings of the 1st ACM international workshop on Wireless sensor networks and applications - WSNA '02 - Wireless sensor networks for habitat monitoring

Mainwaring, Alan, Culler, David, Polastre, Joseph, Szewczyk, Robert, Anderson, John

Year:

2002

Language:

english

File:

PDF, 529 KB

english, 2002

3

[ACM Press the 2nd international conference - Baltimore, MD, USA (2004.11.03-2004.11.05)] Proceedings of the 2nd international conference on Embedded networked sensor systems - SenSys '04 - Versatile low power media access for wireless sensor networks

Polastre, Joseph, Hill, Jason, Culler, David

Year:

2004

Language:

english

File:

PDF, 517 KB

english, 2004

4

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

Knickerbocker, J. U., Andry, P. S., Buchwalter, L. P., Deutsch, A., Horton, R. R., Jenkins, K. A., Kwark, Y. H., McVicker, G., Patel, C. S., Polastre, R. J., Schuster, C. D., Sharma, A., Sri-Jayantha,

Journal:

IBM Journal of Research and Development

Year:

2005

Language:

english

File:

PDF, 1.44 MB

english, 2005

5

Three-dimensional silicon integration

Knickerbocker, J. U., Andry, P. S., Dang, B., Horton, R. R., Interrante, M. J., Patel, C. S., Polastre, R. J., Sakuma, K., Sirdeshmukh, R., Sprogis, E. J., Sri-Jayantha, S. M., Stephens, A. M., Topol,

Journal:

IBM Journal of Research and Development

Year:

2008

Language:

english

File:

PDF, 1.43 MB

english, 2008

6

[IEEE IPSN 2005. Fourth International Symposium on Information Processing in Sensor Networks, 2005. - Los Angeles, CA, USA (25-27 April 2005)] IPSN 2005. Fourth International Symposium on Information Processing in Sensor Networks, 2005. - Perpetual environmentally powered sensor networks

Xiaofan Jiang,, Polastre, J., Culler, D.

Year:

2005

Language:

english

File:

PDF, 646 KB

english, 2005

7

[IEEE The Second IEEE Workshop on Embedded Networked Sensors, 2005. EmNetS-II. - Sydney, Australia (30-31 May 2005)] The Second IEEE Workshop on Embedded Networked Sensors, 2005. EmNetS-II. - Exploiting the Capture Effect for Collision Detection and Recovery

Whitehouse, K., Woo, A., Jiang, F., Polastre, J., Culler, D.

Year:

2005

Language:

english

File:

PDF, 372 KB

english, 2005

8

[IEEE 2012 IEEE/CPMT 28th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM) - San Jose, CA, USA (2012.03.18-2012.03.22)] 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) - Measurement of microbump thermal resistance in 3D chip stacks

Colgan, E. G., Andry, P., Dang, B., Magerlein, J. H., Maria, J., Polastre, R. J., Wakil, J.

Year:

2012

Language:

english

File:

PDF, 759 KB

english, 2012

9

A Practical Implementation of Silicon Microchannel Coolers for High Power Chips

Colgan, Evan G., Furman, Bruce, Gaynes, Michael, Graham, Willian S., LaBianca, Nancy C., Magerlein, John H., Polastre, Robert J., Rothwell, Mary Beth, Bezama, R. J., Choudhary, Rehan, Marston, Kenneth

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2007

Language:

english

File:

PDF, 3.69 MB

english, 2007

10

Embedded Two-Phase Cooling of Large Three-Dimensional Compatible Chips With Radial Channels

Schultz, Mark, Yang, Fanghao, Colgan, Evan, Polastre, Robert, Dang, Bing, Tsang, Cornelia, Gaynes, Michael, Parida, Pritish, Knickerbocker, John, Chainer, Timothy

Journal:

Journal of Electronic Packaging

Year:

2016

Language:

english

File:

PDF, 2.37 MB

english, 2016

11

3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias

Knickerbocker, J.U., Patel, C.S., Andry, P.S., Tsang, C.K., Buchwalter, L.P., Sprogis, E.J., Hua Gan, Horton, R.R., Polastre, R.J., Wright, S.L., Cotte, J.M.

Journal:

IEEE Journal of Solid-State Circuits

Year:

2006

Language:

english

File:

PDF, 2.73 MB

english, 2006

12

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - 2.5D and 3D technology challenges and test vehicle demonstrations

Knickerbocker, J. U., Andry, P. S., Colgan, E., Dang, B., Dickson, T., Gu, X., Haymes, C., Jahnes, C., Liu, Y., Maria, J., Polastre, R. J., Tsang, C. K., Turlapati, L., Webb, B. C., Wiggins, L., Wrigh

Year:

2012

Language:

english

File:

PDF, 1.92 MB

english, 2012

13

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

Sakuma, K., Andry, P. S., Tsang, C. K., Wright, S. L., Dang, B., Patel, C. S., Webb, B. C., Maria, J., Sprogis, E. J., Kang, S. K., Polastre, R. J., Horton, R. R., Knickerbocker, J. U.

Journal:

IBM Journal of Research and Development

Year:

2008

Language:

english

File:

PDF, 1.03 MB

english, 2008

14

A six-mask TFT-LCD process using copper-gate metallurgy

P. M. Fryer, E. Colgan, E. Galligan, W. Graham, R. Horton, D. Hunt, L. Jenkins, R. John, P. Koke, Y. Kuo, K. Latzko, F. Libsch, A. Lien, R. Nywening, R. Polastre, M. E. Rothwell, J. Wilson, R. Wisnief

Journal:

Journal of the Society for Information Display

Year:

1997

File:

PDF, 2.83 MB

1997

15

3D chip stacking with C4 technology

Dang, B., Wright, S. L., Andry, P. S., Sprogis, E. J., Tsang, C. K., Interrante, M. J., Webb, B. C., Polastre, R. J., Horton, R. R., Patel, C. S., Sharma, A., Zheng, J., Sakuma, K., Knickerbocker, J.

Journal:

IBM Journal of Research and Development

Year:

2008

Language:

english

File:

PDF, 1.17 MB

english, 2008

16

[IEEE IPSN 2005. Fourth International Symposium on Information Processing in Sensor Networks, 2005. - Los Angeles, CA, USA (25-27 April 2005)] IPSN 2005. Fourth International Symposium on Information Processing in Sensor Networks, 2005. - Telos: enabling ultra-low power wireless research

Polastre, J., Szewczyk, R., Culler, D.

Year:

2005

Language:

english

File:

PDF, 280 KB

english, 2005

17

Habitat monitoring with sensor networks

Szewczyk, Robert, Osterweil, Eric, Polastre, Joseph, Hamilton, Michael, Mainwaring, Alan, Estrin, Deborah

Journal:

Communications of the ACM

Year:

2004

Language:

english

File:

PDF, 209 KB

english, 2004

18

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - 3D silicon integration

Knickerbocker, J.U., Andry, P.S., Dang, B., Horton, R.R., Patel, C S., Polastre, R.J., Sakuma, K., Sprogis, E.S., Tsang, C.K., Webb, B.C., Wright, S.L.

Year:

2008

Language:

english

File:

PDF, 688 KB

english, 2008

19

[ACM Press the 3rd international conference - San Diego, California, USA (2005.11.02-2005.11.04)] Proceedings of the 3rd international conference on Embedded networked sensor systems - SenSys '05 - A macroscope in the redwoods

Tolle, Gilman, Gay, David, Hong, Wei, Polastre, Joseph, Szewczyk, Robert, Culler, David, Turner, Neil, Tu, Kevin, Burgess, Stephen, Dawson, Todd, Buonadonna, Phil

Year:

2005

Language:

english

File:

PDF, 4.88 MB

english, 2005

20

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - 3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections

Sakuma, K, Andry, P.S., Dang, B., Maria, J., Tsang, C.K., Patel, C., Wright, S.L., Webb, B., Sprogis, E., Kang, S.K., Polastre, R., Horton, R., Knickerbocker, J.U.

Year:

2007

Language:

english

File:

PDF, 6.04 MB

english, 2007

21

Performance of thin hydrogenated amorphous silicon thin-film transistors

J. Kanicki, F. R. Libsch, J. Griffith, R. Polastre

Journal:

Journal of Applied Physics

Year:

1991

Language:

english

File:

PDF, 1.03 MB

english, 1991

22

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - 3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections

Maria, J., Dang, B., Wright, S. L., Tsang, C. K., Andry, P., Polastre, R., Liu, Y., Wiggins, L., Knickerbocker, J. U.

Year:

2011

Language:

english

File:

PDF, 977 KB

english, 2011

23

[IEEE Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005. - San Jose, CA, USA (March 15-17, 2005)] Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005. - A practical implementation of silicon microchannel coolers for high power chips

Colgan, E.G., Furman, B., Gaynes, M., Graham, W., LaBianca, N., Magerlein, J.H., Polastre, R.J., Rothwell, M.B., Bezama, R.J., Choudhary, R., Marston, K., Toy, H., Wakil, J., Zitz, J., Schmidt, R.

Year:

2005

Language:

english

File:

PDF, 1.03 MB

english, 2005

24

[IEEE IEEE 2005 Custom Integrated Circuits Conference, 2005. - San Jose, CA, USA (Sept. 18-21, 2005)] Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005. - Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology

Knickerbocker, J.U., Patel, C.S., Andry, P.S., Tsang, C.K., Buchwalter, L.P., Sprogis, E., Hua Gan,, Horton, R.R., Polastre, R., Wright, S.L., Schuster, C., Baks, C., Doany, F., Rosner, J., Cordes, S

Year:

2005

Language:

english

File:

PDF, 308 KB

english, 2005

25

Thin-film-transistor process-characterization test structures

Colgan, E. G., Polastre, R. J., Takeichi, M., Wisnieff, R. L.

Journal:

IBM Journal of Research and Development

Year:

1998

Language:

english

File:

PDF, 887 KB

english, 1998

26

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Assembly, Characterization, and Reworkability of Pb-free Ultra-Fine Pitch C4s for System-on-Package

Dang, B., Wright, S. L., Andry, P.S., Tsang, C.K., Patel, C., Polastre, R., Horton, R., Sakuma, K., Webb, B.C., Sprogis, E., Zhang, G., Sharma, A., Knickerbocker, J.U.

Year:

2007

Language:

english

File:

PDF, 5.28 MB

english, 2007

27

[IEEE Conference Record of the 1991 International Display Research Conference - San Diego, CA, USA (15-17 Oct. 1991)] Conference Record of the 1991 International Display Research Conference - Characterization of TFT/LCD arrays

Troutman, R.R., Jenkins, L.C., Polastre, R.J., Wisnieff, R.L.

Year:

1991

File:

PDF, 266 KB

1991

28

[IEEE 2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm 2013) - San Jose, CA (2013.3.17-2013.3.21)] 29th IEEE Semiconductor Thermal Measurement and Management Symposium - Measurement of back end of line thermal resistance for 3D chip stacks

Colgan, E. G., Polastre, R. J., Knickerbocker, J., Wakil, J., Gambino, J., Tallman, K.

Year:

2013

Language:

english

File:

PDF, 683 KB

english, 2013

29

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Reliability testing of through-silicon vias for high-current 3D applications

Wright, Steven L., Andry, Paul S., Sprogis, Edmund, Dang, Bing, Polastre, Robert J.

Year:

2008

Language:

english

File:

PDF, 988 KB

english, 2008

30

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration

Dang, Bing, Andry, Paul, Tsang, Cornelia, Maria, Joana, Polastre, Robert, Trzcinski, Robert, Prabhakar, Aparna, Knickerbocker, John

Year:

2010

Language:

english

File:

PDF, 668 KB

english, 2010

31

[IEEE Second European Workshop on Wireless Sensor Networks - Istanbul, Turkey (31 Jan.-2 Feb. 2005)] Proceeedings of the Second European Workshop on Wireless Sensor Networks, 2005. - Flexible hardware abstraction for wireless sensor networks

Handziski, V., Polastre, J., Hauer, J., Sharp, C., Wolisz, A., Culler, D.

Year:

2005

Language:

english

File:

PDF, 2.10 MB

english, 2005

32

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM

Lu, Minhua, Lauro, Paul, Shih, Da-Yuan, Polastre, Robert, Goldsmith, Charles, Henderson, Donald W., Zhang, Hongqing, Moon Gi Cho,

Year:

2008

Language:

english

File:

PDF, 805 KB

english, 2008

33

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - 3D chip stack with integrated decoupling capacitors

Dang, Bing, Wright, Steven L., Andry, Paul, Sprogis, Edmund, Ketkar, Supriya, Tsang, Cornelia, Polastre, Robert, Knickerbocker, John

Year:

2009

Language:

english

File:

PDF, 799 KB

english, 2009

34

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - System-on-Package (SOP) Technology, Characterization and Applications

Knickerbocker, J.U., Andry, P.S., Buchwalter, L.P., Colgan, E.G., Cotte, J., Gan, H., Horton, R.R., Sri-Jayantha, S.M., Magerlein, J.H., Manzer, D., McVicker, G., Patel, C.S., Polastre, R.J., Sprogis,

Year:

2006

Language:

english

File:

PDF, 720 KB

english, 2006

35

Functional testing of TFT/LCD arrays

Jenkins, L. C., Polastre, R. J., Troutman, R. R., Wisnieff, R. L.

Journal:

IBM Journal of Research and Development

Year:

1992

Language:

english

File:

PDF, 810 KB

english, 1992

36

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Advanced wafer bonding and laser debonding

Andry, P., Budd, R., Polastre, R., Tsang, C., Dang, B., Knickerbocker, J., Glodde, M.

Year:

2014

Language:

english

File:

PDF, 660 KB

english, 2014

37

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Transferrable fine pitch probe technology

Liu, Y., Wright, S. L., Dang, B., Andry, P., Polastre, R., Knickerbocker, J.

Year:

2014

Language:

english

File:

PDF, 2.73 MB

english, 2014

38

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Characterization of Micro-Bump C4 Interconnects for Si-Carrier SOP Applications

Wright, S.L., Polastre, R., Gan, H., Buchwalter, L.P., Horton, R., Andry, P.S., Sprogis, E., Patel, C., Tsang, C., Knickerbocker, J., Lloyd, J.R., Sharma, A., Sri-Jayantha, M.S.

Year:

2006

Language:

english

File:

PDF, 685 KB

english, 2006

39

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Pb-free Micro-joints (50 um pitch) for the Next Generation Micro-systems: the Fabrication, Assembly and Characterization

Gan, H., Wright, S.L., Polastre, R., Buchwalter, L.P., Horton, R., Andry, P.S., Patel, C., Tsang, C., Knickerbocker, J., Sprogis, E., Pavlova, A., Kang, S.K., Lee, K.W.

Year:

2006

Language:

english

File:

PDF, 756 KB

english, 2006

40

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Characterization of stacked die using die-to-wafer integration for high yield and throughput

Sakuma, K., Andry, P.S., Tsang, C.K., Sueoka, K., Oyama, Y., Patel, C., Dang, B., Wright, S.L., Webb, B.C., Sprogis, E., Polastre, R., Horton, R., Knickerbocker, J.U.

Year:

2008

Language:

english

File:

PDF, 1.96 MB

english, 2008

41

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Micro-interconnection reliability: Thermal, electrical and mechanical stress

Wright, S. L., Tsang, C. K., Maria, J., Dang, B., Polastre, R., Andry, P., Knickerbocker, J.

Year:

2012

Language:

english

File:

PDF, 864 KB

english, 2012

42

The emergence of a networking primitive in wireless sensor networks

Levis, Philip, Woo, Alec, Brewer, Eric, Culler, David, Gay, David, Madden, Samuel, Patel, Neil, Polastre, Joe, Shenker, Scott, Szewczyk, Robert

Journal:

Communications of the ACM

Year:

2008

Language:

english

File:

PDF, 1.98 MB

english, 2008

43

Medium access control issues in sensor networks

Ali, Muneeb, Saif, Umar, Dunkels, Adam, Voigt, Thiemo, Römer, Kay, Langendoen, Koen, Polastre, Joseph, Uzmi, Zartash Afzal

Journal:

ACM SIGCOMM Computer Communication Review

Year:

2006

Language:

english

File:

PDF, 110 KB

english, 2006

44

[ACM Press the 2nd international conference - Baltimore, MD, USA (2004.11.03-2004.11.05)] Proceedings of the 2nd international conference on Embedded networked sensor systems - SenSys '04 - Flexible hardware abstraction of the TI MSP430 microcontroller in TinyOS

Handziski, Vlado, Polastre, Joseph, Hauer, Jan-Hinrich, Sharp, Cory

Year:

2004

Language:

english

File:

PDF, 70 KB

english, 2004

45

[ACM Press the 3rd international conference - San Diego, California, USA (2005.11.02-2005.11.04)] Proceedings of the 3rd international conference on Embedded networked sensor systems - SenSys '05 - A unifying link abstraction for wireless sensor networks

Polastre, Joseph, Hui, Jonathan, Levis, Philip, Zhao, Jerry, Culler, David, Shenker, Scott, Stoica, Ion

Year:

2005

Language:

english

File:

PDF, 446 KB

english, 2005

46

[ACM Press the 2nd international conference - Baltimore, MD, USA (2004.11.03-2004.11.05)] Proceedings of the 2nd international conference on Embedded networked sensor systems - SenSys '04 - Low power mesh networking with telos and IEEE 802.15.4

Polastre, Joseph, Tolle, Gilman, Hui, Jonathan

Year:

2004

Language:

english

File:

PDF, 86 KB

english, 2004

47

Scouting the path to Buildings 2.0

Polastre, J, Bonnet, Philippe

Journal:

IOP Conference Series Earth and Environmental Science

Year:

2009

Language:

english

File:

PDF, 310 KB

english, 2009

48

[IEEE IEEE 2005 International Interconnect Technology Conference - Burlingame, CA, USA (6-8 June 2005)] Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005. - Characterization of flip chip microjoins up to 40 GHz using silicon carrier

Patel, C.S., Andry, P.S., Jenkins, K.A., Bing Dang,, Horton, R., Polastre, R.J., Tsang, C.K.

Year:

2005

Language:

english

File:

PDF, 501 KB

english, 2005

49

High Conductivity Gate Metallurgy for Tft/Lcd's

Fryer, Peter M., Colgan, E., Galligan, E., Graham, W., Horton, R., Jenkins, L., John, R., Kuo, Y., Latzko, K., Libsch, F., Lien, A., Nywening, R., Polastre, R., Rothwell, M. E., Wilson, J., Wisnieff,

Journal:

MRS Proceedings

Year:

1998

Language:

english

File:

PDF, 4.20 MB

english, 1998

50

High Conductivity Gate Metallurgy for TFT/LCD's

Fryer, Peter M., Colgan, E., Galligan, E., Graham, W., Horton, R., Jenkins, L., John, R., Kuo, Y., Latzko, K., Libsch, F., Lien, A., Nywening, R., Polastre, R., Rothwell, M. E., Wilson, J., Wisnieff,

Journal:

MRS Proceedings

Year:

1998

Language:

english

File:

PDF, 4.13 MB

english, 1998